Description&Applications:
Extremely low oxygen, low impurity content, high purity, excellent electric conductivity, excellent thermal conductivity, excellent ductility, low permeability, no hydrogen disease or very little hydrogen disease. Good machinability, welding, corrosion resistance and cold resistance.
Specifications:
1.Chemical Properties(%):
Cu+Ag | Bi | Sb | As | Fe | Pb | S | O | |
C10100/TU0 | ≥99. 99 | 0. 001 | 0. 002 | 0. 002 | 0. 005 | 0. 005 | 0. 005 | ≤0. 0003 |
C10200/TU1 | ≥99. 97 | 0. 001 | 0. 002 | 0. 002 | 0. 005 | 0. 005 | 0. 005 | ≤0. 0005 |
C10200/TU2 | ≥99. 95 | 0. 001 | 0. 002 | 0. 002 | 0. 005 | 0. 005 | 0. 005 | ≤0. 0005 |
2.SIZE:
Description | Temper | Thickness(MM) | Width(MM) | Length(MM) | MOQ(TON) |
Cold rolled plate | Soft, 1/2H , H, EH | 1. 0-12 | MAX1000 | MAX2000 | 1 |
Cold rolled plate | M20 | MIN12 | MAX600 | MAX1500 | 1 |
STRIP | Soft, 1/2H , H, EH | 0. 15-2. 0 | 200-1000 | ________ | 1 |
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